Application Packaging Engineer H1B Salary & Sponsorship Overview (2026)

Employers filed 6 H1B Labor Condition Applications for Application Packaging Engineer positions, based on official US Department of Labor disclosure data. The average offered salary is $95,180 (median $89,440), with reported wages ranging from $78,187 to $116,000 across 5 sponsoring employers.

Top H1B sponsors for Application Packaging Engineer: EFFINXT LLC; SHOOLIN INC; INFOHUB LLC; CBN TECH FORCE, INC.; SYSINTELLI INC.. Most filings in: NY, CT, TX.