Firmware Engineer II H1B Salary & Sponsorship Overview (2026)

Employers filed 53 H1B Labor Condition Applications for Firmware Engineer II positions, based on official US Department of Labor disclosure data. The average offered salary is $108,094 (median $101,754), with reported wages ranging from $66,602 to $167,000 across 26 sponsoring employers.

Top H1B sponsors for Firmware Engineer II: TOYOTA MATERIAL HANDLING INC.; MILWAUKEE ELECTRIC TOOL CORPORATION; STARKEY LABORATORIES, INC.; GENERAC POWER SYSTEMS; AXON ENTERPRISE, INC.. Most filings in: NY, WI, IL.