Loading H1B data...

Firmware Engineering H1B Salary & Sponsorship Overview (2026)

Employers filed 49 H1B Labor Condition Applications for Firmware Engineering positions, based on official US Department of Labor disclosure data. The average offered salary is $191,147 (median $193,050), with reported wages ranging from $129,000 to $293,638 across 1 sponsoring employers.

$191,147
Average Salary
$193,050
Median Salary
49
LCA Applications
1
Sponsoring Employers

Top H1B sponsors for Firmware Engineering: MICROSOFT CORPORATION. Most filings in: CA, WA, TX.