Ic Packaging Engineering H1B Salary & Sponsorship Overview (2026)

Employers filed 29 H1B Labor Condition Applications for Ic Packaging Engineering positions, based on official US Department of Labor disclosure data. The average offered salary is $164,449 (median $155,043), with reported wages ranging from $143,100 to $216,091 across 1 sponsoring employers.

Top H1B sponsors for Ic Packaging Engineering: APPLE INC.. Most filings in: CA.