Lead Firmware Engineer H1B Salary & Sponsorship Overview (2026)

Employers filed 30 H1B Labor Condition Applications for Lead Firmware Engineer positions, based on official US Department of Labor disclosure data. The average offered salary is $142,006 (median $130,624), with reported wages ranging from $88,200 to $230,000 across 19 sponsoring employers.

Top H1B sponsors for Lead Firmware Engineer: EATON CORPORATION; BOX BOT, INC.; GE MEDICAL SYSTEMS, LLC; CRESTRON ELECTRONICS, INC.; LOGITECH INC.. Most filings in: CA, WI, GA.