Microelectronics Packaging Engineer H1B Salary & Sponsorship Overview (2026)

Employers filed 6 H1B Labor Condition Applications for Microelectronics Packaging Engineer positions, based on official US Department of Labor disclosure data. The average offered salary is $99,117 (median $95,000), with reported wages ranging from $87,975 to $116,325 across 1 sponsoring employers.

Top H1B sponsors for Microelectronics Packaging Engineer: ALLEGRO MICROSYSTEMS, LLC. Most filings in: NH.