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Packaging Development Engineer H1B Salary & Sponsorship Overview (2026)
Employers filed 11 H1B Labor Condition Applications for Packaging Development Engineer positions, based on official US Department of Labor disclosure data. The average offered salary is $98,836 (median $84,510), with reported wages ranging from $70,179 to $131,040 across 8 sponsoring employers.
$98,836
Average Salary
$84,510
Median Salary
11
LCA Applications
8
Sponsoring Employers
Top H1B sponsors for Packaging Development Engineer: INTEPROS INCORPORATED; FUSION LIFE SCIENCES TECHNOLOGIES LLC; WORKLANCE INC.; FRESENIUS KABI USA, LLC; SGD PHARMA PACKAGING, INC.. Most filings in: NJ, PA, FL.