Packaging Engineer H1B Salary & Sponsorship Overview (2026)

Employers filed 966 H1B Labor Condition Applications for Packaging Engineer positions, based on official US Department of Labor disclosure data. The average offered salary is $104,500 (median $104,562), with reported wages ranging from $58,365 to $777,730 across 116 sponsoring employers.

Top H1B sponsors for Packaging Engineer: INTEL CORPORATION; TESLA, INC.; QUALCOMM TECHNOLOGIES, INC.; INTEL FEDERAL LLC; INTELLECTT, INC.. Most filings in: AZ, OR, CA.