Principal Engineer Firmware H1B Salary & Sponsorship Overview (2026)

Employers filed 20 H1B Labor Condition Applications for Principal Engineer Firmware positions, based on official US Department of Labor disclosure data. The average offered salary is $152,999 (median $134,493), with reported wages ranging from $105,269 to $264,514 across 6 sponsoring employers.

Top H1B sponsors for Principal Engineer Firmware: MICROCHIP TECHNOLOGY INC.; CALAMP WIRELESS NETWORKS CORPORATION; SAMSUNG SEMICONDUCTOR, INC.; CYPRESS SEMICONDUCTOR CORPORATION; MICRON TECHNOLOGY, INC.. Most filings in: CA, MN, AZ.