Principal Engineer Firmware Engineering H1B Salary & Sponsorship Overview (2026)

Employers filed 68 H1B Labor Condition Applications for Principal Engineer Firmware Engineering positions, based on official US Department of Labor disclosure data. The average offered salary is $146,288 (median $145,000), with reported wages ranging from $110,000 to $216,587 across 4 sponsoring employers.

Top H1B sponsors for Principal Engineer Firmware Engineering: WESTERN DIGITAL TECHNOLOGIES, INC.; SANDISK TECHNOLOGIES, INC.; GOPRO, INC.; HGST, INC.. Most filings in: CA, CO, AZ.