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Release Engineer III H1B Salary & Sponsorship Overview (2026)

Employers filed 7 H1B Labor Condition Applications for Release Engineer III positions, based on official US Department of Labor disclosure data. The average offered salary is $101,871 (median $100,861), with reported wages ranging from $92,000 to $110,240 across 4 sponsoring employers.

$101,871
Average Salary
$100,861
Median Salary
7
LCA Applications
4
Sponsoring Employers

Top H1B sponsors for Release Engineer III: SUMITOMO ELECTRIC WIRING SYSTEMS, INC.; NETSCOUT SYSTEMS INC.; NETSCOUT SYSTEMS, INC.; GRANITE TELECOMMUNICATIONS, LLC. Most filings in: MI, MA.