Tech Lead Firmware Engineer H1B Salary & Sponsorship Overview (2026)

Employers filed 7 H1B Labor Condition Applications for Tech Lead Firmware Engineer positions, based on official US Department of Labor disclosure data. The average offered salary is $179,768 (median $180,000), with reported wages ranging from $165,174 to $200,743 across 2 sponsoring employers.

Top H1B sponsors for Tech Lead Firmware Engineer: ASTERA LABS INC; ASTERA LABS, INC.. Most filings in: CA.