Wireless Chipset Application Engineer H1B Salary & Sponsorship Overview (2026)

Employers filed 4 H1B Labor Condition Applications for Wireless Chipset Application Engineer positions, based on official US Department of Labor disclosure data. The average offered salary is $185,250 (median $198,000), with reported wages ranging from $143,000 to $200,000 across 1 sponsoring employers.

Top H1B sponsors for Wireless Chipset Application Engineer: ROHDE & SCHWARZ USA, INC.. Most filings in: CA.